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 2MBI300U2B-060
IGBT Module U-Series
Features
* High speed switching * Voltage drive * Low inductance module structure
600V / 300A 2 in one-package
2. Equivalent circuit
Equivalent Circuit Schematic
Applications
* Inverter for Motor drive * AC and DC Servo drive amplifier * Uninterruptible power supply * Industrial machines, such as Welding machines
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25C unless otherwise specified)
Item Collector-Emitter voltage Gate-Emitter voltage Collector current Symbol VCES VGES IC ICp -IC -IC pulse PC Tj Tstg Viso Conditions Rating 600 20 300 600 300 600 1000 +150 -40 to +125 2500 3.5 3.5 Unit V V A
Continuous 1ms
Collector Power Dissipation Junction temperature Storage temperature Isolation voltage between terminal and copper base *1 Screw Torque Mounting *2 Terminals *2
1 device
W C VAC N*m
AC:1min.
*1 : All terminals should be connected together when isolation test will be done. *2 : Recommendable value : Mounting 2.5 to 3.5N*m(M5), Terminal 2.5 to 3.5 N*m(M5)
Electrical characteristics (at Tj=25C unless otherwise specified)
Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Symbols ICES IGES VGE(th) VCE(sat) (terminal) VCE(sat) (chip) Cies ton tr tr(i) toff tf VF (terminal) VF (chip) trr R lead Conditions VGE=0V, VCE=600V VCE=0V, VGE=20V VCE=20V, IC=300mA VGE=15V, IC=300A Tj=25C Tj=125C Tj=25C Tj=125C VCE=10V, VGE=0V, f=1MHz VCC=300V IC=300A VGE=15V RG= 9.1 VGE=0V IF=300A Tj=25C Tj=125C Tj=25C Tj=125C Characteristics Min. Typ. - - - - 6.2 6.7 - 2.10 - 2.35 - 1.80 - 2.05 - 23 - 0.40 - 0.22 - 0.16 - 0.48 - 0.07 - 1.90 - 1.95 - 1.60 - 1.65 - - - 0.97 Unit Max. 2.0 400 7.7 2.45 - - - - 1.20 0.60 - 1.20 0.45 2.30 - - - 0.35 - mA nA V V
Input capacitance Turn-on time
nF s
Turn-off time Forward on voltage
V
Reverse recovery time Lead resistance, terminal-chip*3
IF=300A
s m
*3:Biggest internal terminal resistance among arm.
Thermal resistance characteristics
Items Thermal resistance Contact Thermal resistance Symbols Rth(j-c) Rth(j-c) Rth(c-f)*4 Conditions IGBT FWD With thermal compound Characteristics Min. Typ. - - - - - 0.025 Unit Max. 0.125 0.23 - C/W C/W C/W
*4 : This is the value which is defined mounting on the additional cooling fin with thermal compound.
2MBI300U2B-060
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.) Tj= 25C / chip
750 VGE=20V 15V 600 Collector current : Ic [A] 12V 450 10V Collector current : Ic [A] 600 750 VGE=20V15V
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.) Tj= 125C / chip
12V 10V 450
300
300
150 8V 0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
150
8V
0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip
750 Tj=25C 600 Collector current : Ic [A] Tj=125C Collector - Emitter voltage : VCE [ V ]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25C / chip
10
8
450
6
300
4 Ic=600A Ic=300A Ic=150A
150
2
0 0 1 2 3 4
0 5 10 15 20 25
Collector-Emitter voltage : VCE [V]
Gate - Emitter voltage : VGE [ V ]
Capacitance vs. Collector-Emitter voltage (typ.)
100.0 Capacitance : Cies, Coes, Cres [ nF ] Cies
Dynamic Gate charge (typ.) Vcc=300V, Ic=300A, Tj= 25C
Collector-Emitter voltage : VCE [ 100V/div ] Gate - Emitter voltage : VGE [ 5V/div ]
10.0 Cres Coes 1.0
VGE
VCE 0 500 1000 1500
0.1 0 10 20 30
Collector-Emitter voltage : VCE [V]
Gate charge : Qg [ nC ]
2MBI300U2B-060
IGBT Module
Switching time vs. Collector current (typ.) Vcc=300V, VGE=15V, Rg=9.1, Tj= 25C
10000 Switching time : ton, tr, toff, tf [ nsec ] Switching time : ton, tr, toff, tf [ nsec ] 10000
Switching time vs. Collector current (typ.) Vcc=300V, VGE=15V, Rg=9.1, Tj=125C
1000
toff ton tr tf
1000
ton toff tr
100
100
tf
10 0 150 300 450 600 Collector current : Ic [ A ]
10 0 150 300 450 600 Collector current : Ic [ A ]
Switching time vs. Gate resistance (typ.) Vcc=300V, Ic=300A, VGE=15V, Tj= 25C
10000 Switching loss : Eon, Eoff, Err [ mJ/pulse ] Switching time : ton, tr, toff, tf [ nsec ] 25 ton toff 1000 tr
Switching loss vs. Collector current (typ.) Vcc=300V, VGE=15V, Rg=9.1
Eoff(125C) Eon(125C) Eoff(25C) Eon(25C)
20
15
tf 100
10
5
Err(125C) Err(25C)
10 1.0 10.0 Gate resistance : Rg [ ] 100.0
0 0 150 300 450 600 Collector current : Ic [ A ]
Switching loss vs. Gate resistance (typ.) Vcc=300V, Ic=300A, VGE=15V, Tj= 125C
40 Switching loss : Eon, Eoff, Err [ mJ/pulse ] Eon 600 Collector current : Ic [ A ] 750
Reverse bias safe operating area (max.) +VGE=15V,-VGE <= 15V, RG >= 9.1 ,Tj <= 125C
30
20
Eoff
450
300
10
150 Err 0 1.0 10.0 Gate resistance : Rg [ ] 100.0 0 0 200 400 600 800 Collector - Emitter voltage : VCE [ V ]
2MBI300U2B-060
IGBT Module
a
Forward current vs. Forward on voltage (typ.) chip
1000 Reverse recovery current : Irr [ A ] Reverse recovery time : trr [ nsec ]
Reverse recovery characteristics (typ.) Vcc=300V, VGE=15V, Rg=9.1
750
Forward current : IF [ A ]
600 Tj=25C 450 Tj=125C
100
trr (125C) Irr (125C) Irr (25C) trr (25C)
300
150
0 0 1 2 3 Forward on voltage : VF [ V ]
10 0 150 300 450 600 Forward current : IF [ A ]
Transient thermal resistance (max.)
1.000 Thermal resistanse : Rth(j-c) [C ] /W
FWD 0.100 IGBT
0.010
0.001 0.001
0.010
0.100
1.000
Pulse width : Pw [ sec ]
Outline Drawings, mm M233
3-M5


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